TEHNIČKE SPECIFIKACIJE
Cores 14 (6+8)
Threads 20 (12+8)
Turbo Clock 4.80GHz (Turbo Boost 2.0), 4.80GHz (P-Core), 3.50GHz (E-Core)
Base Clock 2.50GHz (P-Core), 1.80GHz (E-Core)
TDP 65W, cTDP: 65-154W
Graphics yes (Intel UHD Graphics 770)
Socket Intel 1700 (LGA1700), "Socket V"
chipset suitability B660, B760, H610, H670, H770, W680, Z690, Z790
Codename alder Lake-S
Architecture golden Cove
Manufacturing Process Intel 7
L2 cache 11.5MB (6x 1.25MB + 8x 512kB)
L3 cache 24MB
Memory controller Dual Channel DDR5-4800 (PC5-38400), DDR4-3200 (PC4-25600), 76.8GB/s, max. 128GB
ECC support yes
SMT yes (Intel Hyper-Threading)
Remote management yes (Intel vPro)
Unlocked no
Scalability 1 socket (1S)
PCIe Lanes 16x PCIe 5.0, 4x PCIe 4.0
chipset Interface DMI 4.0, 16GT/s (PCIe 4.0 x8)
iGPU-Model Intel UHD Graphics 770
iGPU-Units 32EU / 256 Shader
iGPU-Architecture Gen 12.2, Codename "alder Lake GT1"
iGPU Interface DP 1.4a (7680x4320@60Hz), eDP 1.4b (5120x3200@120Hz), HDMI 2.1 (4096x2160@60Hz)
iGPU-Features 4x display support, 2x Multi-format codec Engine, Intel clear Video HD, Intel Quick Sync Video, AV1 decode, H.265 encode/decode, VP9 encode/decode, HDCP 2.3, DirectX 12.1, OpenGL 4.5, OpenCL 3.0, Vulkan 1.0
Scope of Delivery with CPU cooler (Intel Laminar RM1)
Launch 2023/Q1 (3.1.2023)
Segment desktop (Mainstream)
Stepping H0
Max Temperature 100°C (Tjunction)
Thermal Interface material metal/soldered