SPECIFIKACIJE
Socket 1200 (LGA)
Codename Rocket Lake-S
Graphics no
TDP 125W
Cores 8
Threads 16
Base Clock 3.60GHz
Turbo Clock 5.00GHz
SMT yes (Intel Hyper-Threading)
Memory controller Dual Channel PC4-25600U (DDR4-3200)
ECC support no
Unlocked yes
Remote management no
CPU-Features DL Boost, Turbo Boost Max 3.0 (5.00GHz), Turbo Boost 2.0 (4.90GHz), Hyper-Threading, VT-x, VT-d, VT-x EPT, Intel 64, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, Idle States, EIST, Thermal Monitoring, IPT, GNA 2.0, AES-NI, Secure Key, OS Guard, XD bit, Boot Guard, TDP-down (95W), TDP-down frequency (3.10GHz)
chipset suitability B460, B560, H410 H470, H510, H570, Q470, W480, W590, Z490, Z590
Scope of Delivery without CPU cooler
Segment desktop (Mainstream)
Architecture Cypress Cove
Manufacturing Process 14nm+++ (Intel)
Stepping B0
Launch 2021/Q1 (2021-03-30)
L2 cache 4MB (8x 512kB)
L3 cache 16MB
chipset Interface DMI 3.0, 8GT/s (PCIe 3.0 x8)
PCIe Lanes 20x PCIe 4.0
Memory max. 128GB
Memory bandwidth 50GB/s
Scalability 1 socket
Thermal Interface material metal/soldered
Max Temperature 100°C